The competition is heating up in the flagship smartphone processor market, as MediaTek and Qualcomm both prepare to launch their next-generation premium system-on-chips (SOCs) in Q4 2023.
According to recent social media leaks, MediaTek’s upcoming Dimensity 9300 chip will be fabricated on TSMC’s N4P process and feature one Cortex-X4 core clocked at 3.25GHz, three more X4 cores, four Cortex-A720 cores, and a 12-core Immortalis G720 GPU. While specific benchmark results haven’t been revealed yet, rumors indicate the Dimensity 9300 will surpass the current Snapdragon 8 Gen 3 in both CPU and GPU performance.
This marks a major milestone for MediaTek, as the Dimensity 9300 adopts ARM’s latest big-core CPU architecture for the first time. The single Cortex-X4 “prime core” delivers up to 15% higher performance and 40% improved energy efficiency over the X3. With four A720 cores also providing a boost versus previous A710 cores, the Dimensity 9300 is shaping up to be MediaTek’s most advanced mobile chipset yet.
Qualcomm is anticipated to counter with its next-generation Snapdragon 8 Gen 3, likely built on TSMC’s cutting-edge 3nm process. Official details remain scarce, but it will undoubtedly pack upgraded CPU, GPU, AI, and modem components compared to its predecessor.
The first devices expected to debut the Dimensity 9300 are the Vivo X100 series smartphones, launching in China this November. This sets the stage for a clash between MediaTek and Qualcomm’s best SOCs to kick off 2023. As the arms race in mobile silicon continues, consumers can look forward to even more impressive performance and experiences from leading Android flagships next year.