Xiaomi has finally made it official! The highly anticipated Xiaomi Civi 3 is set to be launched with the world’s first MediaTek Dimensity 8200 Ultra chip. This marks the first time that the Xiaomi Civi series will use the MediaTek mobile platform.
According to Xiaomi, the Dimensity 8200 Ultra is not just a high-performance core, but also an imaging specialty core that has been jointly defined by MediaTek and Xiaomi. This is also the first time that the Xiaomi imaging is fully adapted to the Dimensity mobile platform, which means that the Xiaomi Civi 3’s imaging capabilities will be taken to the next level.
The Xiaomi Civi 3 will feature dual 32-megapixel front cameras, and the rear main camera will be a 50-megapixel Sony’s IMX800 CMOS that supports OIS optical image stabilization. This is great news for photography enthusiasts who are looking for a phone with excellent selfies-camera capabilities.
The MediaTek Dimensity 8200 is designed with a TSMC 4nm process and a 1+3+4 architecture. It has 4 Cortex-A78 large cores and 4 Cortex-A55 small cores, with one A78 large core capable of reaching 3.1GHz. This means that the Xiaomi Civi 3 will have a Pro-level configuration with excellent performance.
The screen shape of Xiaomi Civi 3 is expected to be the same as the Civi 2, which is a long strip of holes similar to the Dynamic Island of the iPhone 14 Pro. However, with a thin and light design, heat dissipation and battery life must be considered.
In addition to all these features, Xiaomi Civi 3 will launch a limited edition in collaboration with Disney’s 100th anniversary. This is sure to excite fans of both brands and add a touch of magic to the smartphone.
Is the Xiaomi Civi 3 the chance for Xiaomi to become the king of selfies in 2023? Only time will tell, but with the MediaTek Dimensity 8200 Ultra chip, the dual 32-megapixel front cameras, and the 50-megapixel rear camera, the Xiaomi Civi 3 is definitely worth looking forward to.